High school seniors in Southern California Edison’s service area are now able to apply for the Edison Scholars program, which provides $50,000 scholarships to students pursuing careers in science, technology, engineering or math (STEM). Edison International announced that its annual $1.5 million scholarship initiative is accepting applications for 30 awards distributed over four years.
Pedro J. Pizarro, president and CEO of Edison International, said: “The ideas, curiosity and drive of today’s students are essential to solving the challenges our communities face. That’s why we invest in Edison Scholars — because we believe in their potential to lead. Over the years, these scholars have gone on to make meaningful contributions in their fields. I’m proud of each class and inspired by their commitment to learning and to creating lasting impact.”
Recipients will also have the opportunity to apply for a paid summer internship with Southern California Edison after completing their first year at an accredited four-year college or university.
To qualify, applicants must be high school seniors living within SCE’s service area who plan to major full-time in a STEM field beginning fall 2026. A minimum cumulative GPA of 3.0 is required as well as demonstrated financial need. The program encourages first-generation college students to apply.
Applications can be submitted at edisonscholars.com until January 22, 2026. Scholarship recipients will be announced in spring 2026.
Edison International has provided more than $20 million in scholarships since 2006 through this program and is recognized as one of Southern California’s leading corporate philanthropic contributors. Funding comes from the Edison International Foundation rather than SCE customers.
Edison International (NYSE: EIX), based in Rosemead, California, is among the largest electric utility holding companies in the United States and serves about 15 million people across Southern, Central and Coastal California through its subsidiary Southern California Edison Company.
